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EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
| Electrical | |
| Electrical, Thermal | |
| Oven, Snap | |
| 2 | |
| 16 Hours | |
| 12,000-20,000cPs @ 20 rpm | |
| =100°C | |
| 2.36 | |
| 150°C/5 min 120°C/10 min 100°C/20 min 80°C/45 min | |
| =5 kg | |
| 0.94 W/mK | |
| 39 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 80D | |
| N/A | |
| Electronics Assembly, Hybrid, Medical | |
| Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LCDs, LEDs, PCB Level Materials, Semiconductor , Solder Replacement, Wafer Level |
